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1210贴片自恢复保险丝

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产品类别：贴片自恢复保险丝

关键词：1210贴片自恢复保险丝

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发布时间：2019-08-10 13:48:12

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1210自恢复贴片保险丝

							Features ■ Surface Mount Devices ■ Lead free device ■ Surface Mount packaging for automated assembly ■ Agency recognition: UL										Applications Almost anywhere there is a low voltage power supply, up to 30V and a load to be protected, including: ■ Computer mother board, Modem. USB hub ■ PDAs & Charger, Analog & digital line card ■ Digital cameras, Disk drivers, CD-ROMs,
SMD 1210 SERIES							ROHS&RICH																FU YUAN
MODEL	MARKING			Vmax			Imax			Ihold		Itrip					Pd			Maximum Time To Trip							Resistance
				(Vdc)			(A)			@25°C (A)		@25°C (A)					Max. (W)			Current (A)				Time (Sec)			Rimin (Ω)			R1max (Ω)
SMD1210-005	αA			30			100			0.05		0.15					0.6			0.25				1.50			2.800			50.000
SMD1210-010	αB			30			100			0.10		0.30					0.6			0.5				0.60			0.800			15.000
SMD1210-020	αC			30			100			0.20		0.40					0.6			8.0				0.02			0.400			5.000
SMD1210-035	αD			6.0			100			0.35		0.75					0.6			8.0				0.20			0.200			1.300
SMD1210-050	αF			13.2			100			0.50		1.00					0.6			8.0				0.10			0.180			0.900
SMD1210-075	αG			6			100			0.75		1.50					0.6			8.0				0.10			0.070			0.400
SMD1210-110	αH			6			100			1.10		2.20					0.6			8.0				0.30			0.050			0.210
SMD1210-150	αL			6			100			1.50		3.00					0.6			8.0				0.50			0.030			0.110
Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd = Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test		Conditions														Resistance change
Passive aging		+85°C, 1000 hrs.														±5% typical
Humidity aging		+85°C, 85% R.H. , 168 hours														±5% typical
Thermal shock		+85°C to -40°C, 20 times														±33% typical
Resistance to solvent		MIL-STD-202,Method 215														No change
Vibration		MIL-STD-202,Method 201														No change
Ambient operating conditions : - 40 °C to 85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
AGENCY APPROVALS : U.L approved
Ihold versus temperature
MODEL			Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)
			-40°C		-20°C			0°C			25°C				40°C				50°C			60°C				70°C			85°C
SMD1210-005			0.08		0.07			0.06			0.05				0.04				0.04			0.03				0.03			0.02
SMD1210-010			0.16		0.14			0.12			0.10				0.08				0.07			0.06				0.05			0.03
SMD1210-020			0.29		0.26			0.22			0.20				0.16				0.14			0.13				0.11			0.08
SMD1210-035			0.47		0.45			0.40			0.35				0.33				0.28			0.24				0.21			0.18
SMD1210-050			0.76		0.67			0.58			0.50				0.43				0.40			0.36				0.32			0.28
SMD1210-075			1.00		0.97			0.86			0.75				0.64				0.59			0.54				0.48			0.40
SMD1210-110			1.69		1.48			1.29			1.10				0.88				0.76			0.65				0.57			0.43
SMD1210-150			2.13		1.92			1.71			1.50				1.26				1.14			1.01				0.89			0.71
Construction and Dimension (Unit:mm)
MODEL			A						B									C							D			E
			Min.			Max.			Min.				Max.					Min.			Max.				Min.			Min.
SMD1210-005			3.00			3.43			2.35				2.80					0.30			0.80				0.30			0.10
SMD1210-010			3.00			3.43			2.35				2.80					0.30			0.80				0.30			0.10
SMD1210-020			3.00			3.43			2.35				2.80					0.30			0.80				0.30			0.10
SMD1210-035			3.00			3.43			2.35				2.80					0.30			0.80				0.30			0.10
SMD1210-050			3.00			3.43			2.35				2.80					0.30			0.80				0.30			0.10
SMD1210-075			3.00			3.43			2.35				2.80					0.30			0.80				0.30			0.10
SMD1210-110			3.00			3.43			2.35				2.80					0.30			0.80				0.30			0.10
SMD1210-150			3.00			3.43			2.35				2.80					0.30			0.80				0.30			0.10

Termination pad characteristics Terminal pad materials： Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability： Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rework Use standard industry practices, the removal device must be replaced with a fresh one.
Thermal derating curve														Typical time-to-trip at 25°C
!WARNING · Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. · PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. · Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. · Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. · Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. · Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices. PPTC SMD can be cleaned by standard methods. · Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profile could negatively impact solderability performance of our devices.
														‧Recommended reflow methods：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom sideof the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. Note：If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Tape and reel specifications (mm) Governing Specifications EIA 481-2
W	8.15 ± 0.3
P0	4.0 ± 0.10
P1	4.0 ± 0.10
P2	2.0 ± 0.05
A0	2.82 ± 0.10
B0	3.52 ± 0.10
B1max.	4.35
D0	1.5 + 0.1, -0
F	7.5 ± 0.05
E1	1.75 ± 0.10
E2min.	6.25
T	0.6
T1max.	0.1
K0	0.90±0.1
Leadermin.	390
Trailermin.	160
Reel Dimensions
A max.	178
N min.	50
W1	8.4 ± 0.5
‧ Storage conditions：40°C max, 70% R.H. ‧ Devices may not meet specified performanc if storage conditions are exceeded.
Order information Packaging SMD1210 050 SMD：surface mount device Current 0. Tape & Reel Quantity 4,000 pcs/reel

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