Description：
This 100% Lead-free, RoHS compliant and Halogen-free fuse series has been designed specifically to provide over current protection to circuits that see high working ambient temperatures (up to 150ºC).
The general design ensures excellent temperature stability and performance reliability.
In addition to this, the high I²t values typical of the Ceramic Fuse family ensure high inrush current withstand capability.
Features：
• Operating Temperature from -55ºC to +150ºC
• 100%Lead-free,RoHS compliant and Halogen-free
• Suitable for both leaded and lead-free reflow /wave soldering
• UltrahighI2t values
Applications：
• Automotive Electronics
• Printers
• LCD Displays
• Servers
• Notebook Computers
• Scanners
• Data Modems
• Hard Disk Drives
Electrical Characteristics for Series
|
% of Ampere rating |
Ampere rating |
OpeningTime at 25ºc |
|
100% |
0.2 - 8A |
4 hours, Minimum |
|
250% |
750mA - 8A |
5 seconds, Maximum |
|
350% |
0.2 - 500mA |
5 secs., Maximum |
|
350% |
750mA - 8A |
1 second, Maximum |
Electrical Specifications by Item
|
Ampere rating (A) |
Amp code |
max. Voltage rating (V) |
interrupting rating (Ac/Dc)1 |
Nominal resistance (Ohms)2 |
Nominal melting i2t (A2Sec.)3 |
nominalVoltage Drop At rated current (V)4 |
nominal power Dissipation At rated current (W) |
Agency Approvals |
|
|
|
|
||||||||
|
0.25 |
.250 |
125 |
50A@125VAC/DC |
2.140 |
0.00649 |
0.5260 |
0.132 |
* |
* |
|
0.375 |
.375 |
125 |
1.216 |
0.01455 |
0.4993 |
0.187 |
* |
* |
|
|
0.5 |
.500 |
63 |
50A@63VAC/DC |
0.8140 |
0.02642 |
0.4831 |
0.242 |
* |
* |
|
0.75 |
.750 |
63 |
0.4624 |
0.09312 |
0.3983 |
0.299 |
* |
* |
|
|
1 |
001. |
50 |
50A@50VAC/DC |
0.3096 |
0.21054 |
0.3457 |
0.346 |
* |
* |
|
1.25 |
1.25 |
50 |
0.2268 |
0.40200 |
0.3240 |
0.405 |
* |
* |
|
|
1.5 |
01.5 |
50 |
0.1759 |
0.50652 |
0.3215 |
0.482 |
* |
* |
|
|
1.75 |
1.75 |
32 |
50A@32VAC/DC |
0.04518 |
0.3312 |
0.0777 |
0.136 |
* |
* |
|
2 |
002. |
32 |
0.03802 |
0.4326 |
0.0792 |
0.158 |
* |
* |
|
|
2.5 |
02.5 |
32 |
0.02850 |
0.8191 |
0.0747 |
0.187 |
* |
* |
|
|
3 |
003. |
32 |
0.02252 |
1.232 |
0.0742 |
0.223 |
* |
* |
|
|
3.5 |
03.5 |
32 |
0.01845 |
1.789 |
0.0757 |
0.265 |
* |
* |
|
|
4 |
004. |
32 |
0.01553 |
2.601 |
0.0709 |
0.284 |
* |
* |
|
|
5 |
005. |
32 |
0.01164 |
4.761 |
0.0654 |
0.327 |
* |
* |
|
|
7 |
007. |
32 |
0.00753 |
8.464 |
0.0696 |
0.487 |
* |
* |
|
|
8 |
008. |
32 |
0.00634 |
12.95 |
0.0655 |
0.524 |
* |
* |
|
Notes:
1. AC Interrupting Rating tested at rated voltage with unity power factor. DC Interrupting Rating tested at rated voltage with time constant < 0.8 msec.
2. Nominal Resistance measured with < 10% rated current.
3. Nominal Melting I²t measured at 1 msec. opening time.
4. Nominal Voltage Drop measured at rated current after temperature has stabilized.
Devices designed to carry rated current for 4 hours minimum. It is recommended that devices be operated continuously at
no more than 80% rated current. See “Temperature Derating Curve”for additional derating information.Devices designed to
be mounted with marking code facing up.
Temperature Derating Curve
Notes:
1. Derating depicted in this curve is in addition to the standard derating of 20% for continuous operation.
Example:
For continuous operation at 75 degrees celsius, the fuse should be derated as follows:I = (0.80)(0.85)IRAT= (0.68)IRAT
Average Time Current Curves
Soldering Parameters
|
Reflow condition |
Pb-freeassembly |
|
|
Pre Heat |
-Temperature min (Ts(min)) |
150°C |
|
-Temperature max (Ts(max)) |
200°C |
|
|
-Time (min to max) (ts) |
60 – 180 seconds |
|
|
Average ramp-up rate (liquidusTemp(TL) to peak |
3°C/second max. |
|
|
TS(max) toTl - ramp-up rate |
5°C/second max. |
|
|
reflow |
-Temperature (Tl)(liquidus) |
217°C |
|
Temperature (tLp) |
60 – 150 seconds |
|
|
peakTemperature (Tp) |
260+0/-5°C |
|
|
Time within 5°C of actual peak Temperature(Tp) |
10 – 30 seconds |
|
|
Ramp-down Rate |
6°C/second max. |
|
|
Time 25°c to peakTemperature (Tp) |
8 minutes max. |
|
|
Do not exceed |
260°C |
|
Product Characteristics
|
Materials |
Body: Advanced Ceramic Terminations: Ag / Ni / Sn (100% Lead-free) Element Cover Coating: Lead-free Glass |
|
Moisture Sensitivity Level |
IPC/JEDECJ-STD-020C,Level1 |
|
Solderability |
IPC/ECA/JEDECJ-STD-002B Condiont C, |
|
Humidity Test |
MIL-STD-202, Method 103B Condiont D |
|
Resistance to Solder Heat |
MIL-STD-202, Method 210F Condiont B |
|
Moisture Resistance |
MIL-STD-202, Method 106G |
|
Thermal Shock |
MIL-STD-202, Method 107G, ConditionB |
|
Mechanical Shock |
MIL-STD-202,Method213B, Condition A |
|
Vibration |
MIL-STD-202, Method 201A |
|
Vibration, High Frequency |
MIL-STD-202, Method 204D, Condition D |
|
Dissolution of Metallization |
IPC/ECA/JEDECJ-STD-002C, Condition D |
|
Terminal Strength |
IEC60127-4 |
Dimensions
|
Part Marking System |
|
|
Amp code |
marking code |
|
.250 |
D |
|
.375 |
E |
|
.500 |
F |
|
.750 |
g |
|
001. |
H |
|
1.25 |
J |
|
01.5 |
k |
|
1.75 |
L |
|
002. |
N |
|
02.5 |
o |
|
003. |
P |
|
03.5 |
R |
|
004. |
S |
|
005. |
T |
|
007. |
W |
|
008. |
X |
Packaging
|
packaging Option |
packaging Specification |
Quantity |
Quantity &packaging code |
|
8mm Tape and Ree |
EIA-481,IEC60286,Part3 |
3000 |
WR |
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